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WJA1035
Product Features
* * * * * * * * 50 - 4000 MHz 15 dB Gain +16 dBm P1dB +36 dBm OIP3 +5V Single Voltage Supply Internal Active Bias Supply Internally matched to 50 Lead-free / RoHS-compliant / Green SOT-89 package
+5V Active-Bias InGaP HBT Gain Block
Product Description
The WJA1035 is a cascadable gain block that offers high linearity in a low-cost surface-mount package. At 1.9 GHz, the WJA1035 typically provides 15 dB gain, +36 dBm OIP3, and +16 dBm P1dB. The device is housed in a leadfree/green/RoHS-compliant SOT-89 industry-standard SMT package using a NiPdAu plating to eliminate the possibility of tin whiskering.
Functional Diagram
GND 4
1
2 GND
3 RF OUT
Applications
* * * * GSM, PCS, CDMA, WCDMA WiMAX, WiBro Repeaters, BTS Transceivers RFID
The WJA1035 consists of Darlington pair amplifiers using a high reliability InGaP/GaAs HBT process technology. The MMIC amplifier is internally matched to 50 and only requires DC-blocking capacitors and a bias inductor for operation. An internal active bias is designed to enable stable performance over temperature. A dropping bias resistor is not required allowing the device to be biased directly from a +5V supply voltage. The broadband amplifier can be directly applied to various current and next generation wireless technologies such as GSM, CDMA, W-CDMA, WiBro, and WiMAX. The WJA1035 is ideal for general purpose applications such as LO buffering, IF amplification and pre-driver stages within the 50 to 4000 MHz frequency range.
RF IN
Function Input Output/Bias Ground
Pin No. 1 3 2, 4
Specifications
Parameter
Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure Device Voltage Device Current
Typical Performance
Units
MHz MHz dB dB dB dBm dBm dB V mA
Min
50
Typ
1900 14.8 19 16 +16.1 +35.6 6.2 5 65
Max
4000
Parameter
Frequency S21 S11 S22 Output P1dB Output IP3 (2) Noise Figure
Units
MHz dB dB dB dBm dBm dB 500 14.3 -14 -19 +18.4 +36.9 5.3
Typical
900 14.2 -17 -19 +17.6 +35.6 5.7 1900 14 -19 -10 +16.1 +34.6 6.2 2100 14 -19 -10 +15.5 +34.5 6.8
1. Listed typical performance parameters measured on evaluation board.
1. Test conditions: 25 C, Supply Voltage = +5.00 V, 50 System. 2. 3OIP measured with two tones at an output power of 0 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. S-parameters and 3OIP measured at device pins. All other specifications measured on evaluation board.
Absolute Maximum Rating
Parameter
Operating Case Temperature Storage Temperature Supply Voltage Input Power -40 to +85 C -55 to +150 C +6.5 V +24 dBm
Rating
Ordering Information
Part No.
WJA1035 WJA1035-PCB
Description
+5V Active Bias InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 Package)
50 - 4000 MHz Fully Assembled Eval. Board
Specifications and information are subject to change without notice
Operation of this device above any of these parameters may cause permanent damage. WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com
Page 1 of 4
Aug 2007
WJA1035
+5V Active-Bias InGaP HBT Gain Block
Typical Evaluation Board RF Performance
Supply Bias = +5.00 V, Icc = 65 mA
1. Test conditions: T = 25 C, Supply Voltage = +5.00 V, Icc = 65 mA typical, 50 System. 2. 3OIP measured with two tones at an output power of 0 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Gain vs. Frequency
22 20
T=25C
Return Loss
0 -5
40
T=25C
OIP3 vs. Frequency
50 45
Pout=0 dBm/tone
S11, S22 (dB)
18
OIP3 (dBm)
Gain (dB)
16 14 12 10
-10 -15 -20
35 30 25 20
S11
8 0 1000 2000 Frequency (MHz) 3000 4000
S22
3000 4000
15 10
-25 0 1000 2000 Frequency (MHz)
-40C
0 1000
+25C
+85C
3000 4000
2000 Frequency (MHz)
Icc vs. Temperature
68
Vcc = +5V
Noise Figure vs. Frequency
14 13 12 11 10 9 8 7 6 5 4 3 2 0
18
Gain vs. Pout
f=1900 MHz
66
16
64
62
-40C
1000
+25C
2000
+85C
10
60 -50
-25
0 25 50 Temperature (C)
75
100
3000
4000
Gain (dB)
Icc (mA)
NF (dB)
14
12
6
8
Frequency (MHz)
Device Current vs. Voltage
10 12 Pout (dBm)
14
16
P Bvs. F u cy 1d req en 30 25
110 100 90 80 70 60 50 40 30 20 4.0
P1dB (dBm)
20 15 10 5
-40C
4.5
+25C
5.0
+85C
0
5.5 6.0
-40C
0 1000
+25C
+85C
3000 4000
2000 F u cy(M z) req en H
Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 2 of 4 Aug 2007
WJA1035
Vcc = 5.00V Icc = 65 mA R4 0
+5V Active-Bias InGaP HBT Gain Block
Application Circuit
C3 Bypass Capacitor
RF IN R1 0
L1 RF Choke RF OUT WJA1035 C1 Blocking Capacitor R2 0 C2 Blocking Capacitor
Recommended Component Values(1) Ref. Name Value / Type L1 470 nH ferrite core wire wound inductor(2) C1, C2 1000 pF NPO chip capacitor C3 0.018 F chip capacitor R1, R2, R4 0 (3) C4, C5, C6, Do Not Place(3) R3, R5, R6, R7, R8
1. 2. 3.
Size 0805 0603 0603 0603
The listed values are contained on the evaluation board to achieve optimal broadband performance For lower cost and performance (500 - 4000 MHz) option use 18 nH air core wire wound inductor. Place holders for the 0 resistors and "Do Not Place" references are not needed for final design.
Typical Device Data
S-Parameters (Vdevice = +5.00 V, ICC = 64 mA, T = 25 C, calibrated to device leads)
Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)
10 50 100 300 500 700 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 2900 3100 3300 3500 3700 3900 4100 4300 4500
-10.17 -12.26 -12.52 -12.54 -12.50 -12.62 -13.08 -13.58 -14.52 -15.46 -16.75 -19.42 -25.75 -26.52 -17.99 -13.57 -10.56 -8.37 -6.60 -5.39 -4.69 -4.14 -3.67 -3.13 -2.77
-62.05 -143.28 -162.17 -177.90 177.96 175.16 170.88 163.68 156.10 149.91 146.80 146.77 160.04 -105.22 -91.58 -98.92 -108.76 -119.89 -130.10 -139.36 -149.24 -160.46 -171.17 -179.86 175.28
19.42 15.43 14.83 14.56 14.56 14.54 14.50 14.54 14.63 14.66 14.69 14.77 14.82 14.67 14.54 14.26 13.76 13.29 12.41 11.46 10.43 9.53 8.50 7.44 6.36
162.82 162.81 166.27 159.56 148.45 136.92 125.59 113.73 101.06 89.00 76.10 62.82 49.54 35.08 19.31 4.52 -10.36 -26.30 -40.96 -54.49 -67.28 -79.14 -90.54 -101.60 -111.29
-22.42 -19.09 -18.88 -18.78 -18.69 -18.76 -18.64 -18.59 -18.50 -18.49 -18.35 -18.31 -18.30 -18.40 -18.45 -18.70 -18.96 -19.33 -19.69 -20.18 -20.55 -20.80 -20.98 -21.23 -21.55
25.76 8.25 3.06 -4.07 -8.32 -12.86 -17.42 -22.37 -26.52 -31.10 -36.02 -41.17 -46.76 -52.76 -58.43 -64.51 -70.20 -75.81 -80.92 -84.47 -88.49 -91.02 -94.42 -97.85 -100.66
-6.92 -13.97 -15.94 -17.23 -18.02 -18.75 -19.49 -19.55 -18.79 -17.99 -16.95 -15.71 -13.77 -11.78 -9.93 -8.64 -7.77 -7.10 -6.57 -6.12 -5.88 -5.83 -5.94 -6.32 -6.32
-45.51 -117.48 -143.89 -169.98 -178.40 178.73 -179.14 -169.53 -158.21 -148.44 -140.24 -136.15 -136.39 -142.64 -150.42 -157.92 -166.68 -177.36 170.51 160.46 152.12 145.87 138.78 129.66 118.08
Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 3 of 4 Aug 2007
WJA1035
+5V Active-Bias InGaP HBT Gain Block
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 C reflow temperature) and leaded (maximum 245 C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Mechanical Information
Outline Drawing
Product Marking
The WJA1035 will be marked with an "A1035" designator with an alphanumeric lot code marked below the part designator. Tape and reel specifications for this part are located on the website in the "Application Notes" section.
MSL / ESD Rating
Land Pattern
ESD Rating: Value: Test: Standard: ESD Rating: Value: Test: Standard:
Class 1C Passes 1000V min. Human Body Model (HBM) JEDEC Standard JESD22-A114 Class IV Passes 1000V min. Charged Device Model (CDM) JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees.
Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 4 of 4 Aug 2007

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